LR700系列金属剥离胶LR712-100/020

产品详细介绍

LR700 系列金属剥离胶主要应用于无

线设备、光电子芯片、MEMS 及半导体封装等

领域，作为微米、亚微米金属剥离工艺中双

层剥离工艺的显影牺牲层，LR721 系列产品

相比较LR711系列产品具有更小的内切深度，

适合于内切深度小于 1µm 的金属剥离工艺。

INTRODUCTION

LR700 series metal lift-off resin mainly

used in IC manufacture such as wireless

devices, optoelectronic chips,MEMS and

semiconductor packaging. As the development

sacrificial layer of the tri-layer lift-off process

in the micron and sub-micron metal lift-off

process , compared with the LR711 series the

LR712 series have smaller under-cut length, suitable for metal lift-off process with

under-cut length less than 1µm. 产品性能

 金属剥离胶膜厚 0.2-1.0μm；

 内切深度控制；

 良好的附着力；

 良好工艺兼容性；

 平坦化性能。

FEATURES

 The thickness range of LR700 series ：

0.2-5μm;

 The under-cut length controllable;

 Good adhesion;

 Good process compatibility;

 Excellent planarization performance. 产品型号 PRODUCT RANGE

Spin Curve Pattern Profiles

Product name LR712-100/020 LR711-200/100/050

Film thickness 1.5-0.8um 0.8-0.4um

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