ABLESTIK JM7000具有高可靠性，低空洞特点，耐高温可达370度。
常用超大规模集成电路封装，陶瓷焊接封装和焊接密封封装
LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die sizes
up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, HAAKE RV-20 Rotoviscometer, mPa·s (cP):
Cone 1º @ Shear rate 22 s
-1 9,000
Work Life @ 25°C, hours 8 to 16
Shelf Life @ -40°C (from date of manufacture), days 365
TYPICAL CURING PERFORMANCE
Cure Schedule
30 minutes @ 150°C
Suggested temperature cures are from 150 to 350ºC. For
applications requiring higher electrical conductivity, a cure cycle of 15
minutes @ 300ºC is recommended. Product properties will not be
reduced by subsequent post die attach thermal exposure, i.e.,
wirebond, and/or lid seal up to 370ºC.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Coefficient of Thermal Expansion, :
Below Tg, ppm/°C 33
Glass Transition Temperature (Tg) by TMA, °C 240
Bulk Thermal Conductivity, W/(m-K):
@ 90°C 1.1
@ 165°C 1.0
Tensile Modulus, DMTA :
Cured 30 minutes @ 300ºC N/mm² 10,000
(psi) (1,450,377)
Extractable Ionic Content, @ 100°C:
Chloride (Cl-) <10
Sodium (Na+) <15
Potassium (K+) <15
Decomposition (in N2):
TGA analysis @ 10ºC/ minute ramp from 25 to 400
ºC
@ 340ºC, % 0.2
@ 400ºC, % 0.3
Electrical Properties
Sample cured 30 minutes @ 300ºC
Volume Resistivity, ohm-cm ≤0.01
TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength:
2 X 2 mm Si die, kg-f,
cured 20 minutes @ 150ºC
Substrate DSS
Ag/Cu LF ≥5
Tensile Strength :
cured 30 minutes @ 300ºC, MPa
After Cure After 1000 TC'C"
>17 >17
Radius of Curvature:
Si die on Alumina, meters
cured 30 minutes @ 300ºC
Chip Size: ROC
15 x 15 mm > 5
Ablestik 84-1LMISR4是一种单组份、低粘度的导电银胶。胶流变性能好，适用于高速die attach封装，无拉丝和拖尾；纯度高，广泛应用在半导体工业主要用于半导体芯片的粘贴，适用于全自动机器高速点胶，是目前世界上出胶速度 快的一款导电银胶。特点 流变性能好，适用于高速die attach封装，无拉丝和拖尾；纯度高，广泛应用在半导体工业.
84-1 LMISR4导电银胶适用于全自动机器高速点胶。Ablebond 84-1 LMISR4导电银胶允许 少量胶分配，并降低停留时间，而无残胶或拉丝的烦恼。
包装规格：5cc 10cc
ABLESTIK 84-1A，84-1LMIT1,84-3等
ABLESTIK 5020 506胶膜
深圳汉高导电胶 西安汉高导电胶 沈阳汉高代理 山东汉高代理 西安导电胶 山东导电胶 广州导电胶 导电胶
汉高乐泰导电胶,杨浦厚膜汉高ABLESTIKJM7000导电胶
面议
产品名：汉高ABLESTIKJM7000导电胶,JM7000导电胶,汉高导电胶,乐泰导电胶
ablestik84-1A导电胶
面议
产品名：导电胶,耐高温导电胶,84-1A导电胶,84-1LMI导电胶
乐泰FP4531底部填充剂,重庆FP4531底部填充胶
面议
产品名：FP4531底部填充胶,4531TD底部填充胶,FP4531底部填充剂,FP4531TD底填胶
山东4450HF围坝胶传感器,乐泰围坝胶
面议
产品名：4450HF围坝胶,乐泰4450HF,乐泰4450围坝胶,乐泰围坝胶
陕西晶圆临时键合解键合材料半导体,晶圆临时键合
面议
产品名：晶圆临时键合解键合材料,晶圆临时键合解键合胶,晶圆临时键合水解材料,晶圆临时键合
汉高乐泰汉高乐泰UF1173,云南UF1173底部填充胶芯片
面议
产品名：UF1173底部填充胶,乐泰UF1173,汉高底部填充胶,汉高乐泰UF1173
汉高乐泰乐泰8200T导电胶,晶圆钝化设备
面议
产品名：乐泰ABLESTIK8200T导电胶,乐泰8200T导电胶,ablestik 8200T,耐高温导电胶
西藏汉高乐泰8830s底部填充剂半导体
面议
产品名：乐泰8830s底部填充剂,Underfill 8830S,8830底部填充胶,芯片底部填充胶