ABLESTIK JM7000具有高可靠性，低空洞特点，耐高温可达370度。
常用超大规模集成电路封装，陶瓷焊接封装和焊接密封封装
乐泰EA 3335透明UV耐热耐水耐腐蚀光通讯光路胶
粘度 5000-7000cp 固化条件 UV 硬度80shoreA Tg值 135℃ CTE,低于Tg温度59ppm/℃ CTE,Tg值温度 ppm/℃
透明，UV快速固化，良好的耐热，耐水，耐化学腐蚀性，低挥发。
乐泰ABLESTIK JM 7000
氰酸酯
外观银
治疗热治疗
填料型银
●良好的附着力
●水分低
●离子杂质低
●可靠性高
●空洞少
●导电
●导热
应用模连接
基板氧化铝，镀金氧化铝
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, HAAKE RV-20 Rotoviscometer, mPa·s (cP):
Cone 1º @ Shear rate 22 s
-1 9,000
Work Life @ 25°C, hours 8 to 16
Shelf Life @ -40°C (from date of manufacture), days 365
TYPICAL CURING PERFORMANCE
Cure Schedule
30 minutes @ 150°C
Suggested temperature cures are from 150 to 350ºC. For
applications requiring higher electrical conductivity, a cure cycle of 15
minutes @ 300ºC is recommended. Product properties will not be
reduced by subsequent post die attach thermal exposure, i.e.,
wirebond, and/or lid seal up to 370ºC.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties
Coefficient of Thermal Expansion, :
Below Tg, ppm/°C 33
Glass Transition Temperature (Tg) by TMA, °C 240
Bulk Thermal Conductivity, W/(m-K):
@ 90°C 1.1
@ 165°C 1.0
Tensile Modulus, DMTA :
Cured 30 minutes @ 300ºC N/mm² 10,000
(psi) (1,450,377)
Extractable Ionic Content, @ 100°C:
Chloride (Cl-) <10
Sodium (Na+) <15
Potassium (K+) <15
Decomposition (in N2):
TGA analysis @ 10ºC/ minute ramp from 25 to 400
ºC
@ 340ºC, % 0.2
@ 400ºC, % 0.3
Electrical Properties
Sample cured 30 minutes @ 300ºC
Volume Resistivity, ohm-cm ≤0.01
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